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Rework system for Pb (lead) free

BGA reball / printing tool / mask

X-ray inspection equipment

Cleaning equipment

Pb (lead) free solder material · flux

SMT process related equipments

Soldering tool / Soldering related equipment

We will exhibit INTERNEPCON JAPAN 2019

We will exhibit INTERNEPCON JAPAN 2019

January 16[Wed]-18[Fri],2019 10:00-18:00 (last day until 17:00)

Booth number:E1-4

Official site

https://www.nepconjapan.jp/en-gb.html

過去記事

2017
2016

Product Info

Rework system for Pb (lead) free
BGA reball / printing tool / mask

X-ray inspection equipment
Cleaning equipment
Pb (lead) free solder material · flux
SMT process related equipments
Soldering tool / Soldering related equipment

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