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Rework system for Pb (lead) free

BGA reball / printing tool / mask

X-ray inspection equipment

Cleaning equipment

Pb (lead) free solder material · flux

SMT process related equipments

Soldering tool / Soldering related equipment

We will exhibit at the 36th INTERNEPCON JAPAN

We will exhibit at the 36th INTERNEPCON JAPAN

Venue: Tokyo Big Sight, Japan
Exhibition Hall East Hall 1
Booth No. 6-12

Date and Time: January 19 (Wed.) – 21 (Fri.), 2022
Hours: 10:00 – 18:00 (last day until 17:00)

過去記事

2017
2016

Product Info

Rework system for Pb (lead) free
BGA reball / printing tool / mask

X-ray inspection equipment
Cleaning equipment
Pb (lead) free solder material · flux
SMT process related equipments
Soldering tool / Soldering related equipment

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